Recently, the 9th Developer Conference, an annual grand event in the semiconductor industry hosted by Rockchip Electronics Co., LTD. (hereinafter referred to as "Rockchip"), grandly kicked off at the Strait International Convention and Exhibition Center in Fuzhou. The conference, themed "AIoT Model Innovation and Remaking Products", brought together leading figures in the industry to share AI applications and cutting-edge technologies in emerging industries, and to have face-to-face discussions and exchanges with industry, academia, research institutions and developers. The R&D director of Guangzhou Dazzle View Intelligent Technology Co., LTD. (referred to as "Dazzle View Intelligent") led a team to attend. More than 4,000 people, including representatives from leading enterprises in the industry, front-line R&D engineers, university representatives, and government representatives, witnessed the product updates and reshaping under the new wave of AI technology together.
Industry experts discuss the future of AI
On the first day of the conference, the main forum focused on AIoT, edge-side models and scenario-based applications. Guests such as Wu Xiaoru, president of iFLYTEK, and Hu Lulu, a scientist from Alibaba Cloud, delivered keynote speeches and engaged in in-depth dialogues on the evolution of AI technology and industrial integration. Zhao Mingzheng, the vice mayor of Fuzhou City, attended and delivered a speech, emphasizing that the city will promote the deep integration of artificial intelligence and the real economy through the "five-chain integration" policy of the innovation chain, talent chain, capital chain, industrial chain and information chain, and optimize the industrial ecosystem of integrated circuits.
Rockchip has released a series of new products including the edge-side AI large model coprocessors RK1820/RK1828, industrial and display control processors RK3506/RK3506J, the new generation 4K general-purpose vision processor RV1126B, the high cost-performance audio processor RK2116, and the low-power wireless chip RK962, as well as related AI algorithms. Lin Zhengyuan, senior vice president of Rockchip, elaborated on Rockchip's new-generation product system and product logic, covering the layout of basic chips and enhancing core skills. Led by the flagship chip, a series of chips evolved under the same manufacturing process form a wild goose formation. With different supporting chips, multiple solutions are formed.
Mr. Li Shiqin, Senior Vice President of Rockchip, introduced Rockchip's R&D path of "system, IP, and chip" interaction. He also highlighted the company's new flagship chip RK3688 and its sister chip RK3668, as well as the next-generation coprocessor RK1860. The company's development path is a dual-track platform featuring parallel R&D and rapid iteration of SoC and coprocessors.
Mr. Li Min, Chairman and CEO of Rockchip, pointed out in his keynote speech titled "AIoT2.0 - Model Innovation Reshaping Products" that the edge-side model-driven approach will drive AIoT into the 2.0 era of functional integration. Rockchip is committed to building an innovative ecosystem of symbiosis and win-win with its ecosystem partners.
Ecological co-construction unlocks a new paradigm for AI development
A total of 11 application exhibition areas and 58 booths of ecosystem partners were set up at the conference, comprehensively showcasing the technological breakthroughs and full-scenario ecosystem based on Rockchip, including new product exhibition areas, automotive electronics, robots, commercial applications, office and conference, industry applications, machine vision, consumer electronics, operators, audio technology and industry development boards. Products such as AI motherboards and smart commercial terminals equipped with Rockchip's RK3588, RK3568, RK3576, and RK3562 chips were respectively exhibited, covering fields such as industry, edge computing, Internet of Things, and robotics, fully demonstrating the rich achievements made by Rockchip in collaborative research and development with its ecosystem partners.
As one of the ecosystem partners deeply cooperating with Rockchip, Dazzle View Intelligent's cutting-edge product solutions developed using the RK3588, RK3576 and other series of chips shone brightly at this year's ISE exhibition. This series of products is built on a high-performance chip platform and has powerful computing and processing capabilities, which can efficiently support complex teaching application scenarios. The RK3588, RK3576 and other series of product solutions are all based on the Android operating system. In terms of software functions, the AI function is particularly prominent, providing educational electronic self-boards, AI-assisted teaching, multi-screen interaction and other functions, which can better facilitate teaching training, meetings and other educational and commercial market applications, and support customized human-computer interaction UI systems. It offers a friendly human-computer interaction experience and is highly favored by customers both at home and abroad.
In the era of AI technology reshaping the industrial landscape, Rockchip is taking the developer conference as a fulcrum to leverage the innovative potential of the entire industry. Dazzle View Intelligence looks forward to strengthening cooperation with Rockchip to promote the evolution of smart terminals from single-function devices to scenario-based, intelligent and personalized directions, and jointly usher in the "scene revolution" era of AIoT.
